How To Reball Iphone Bga Stencil Template

Acquire What is BGA Reballing Kit for Mobile Phone Repairing and How to Reball BGA IC.

BGA Reballing Kit for Mobile Telephone Repairing are needed to repair Brawl Grid Array IC on PCB of a Mobile Phone.

What is BGA Reballing Kit?

BGA Reballing Kit is used for reballing the solder assurance of a BGA IC (Ball Filigree Array). There are several Kits and BGA rework stations available in the market. Most repairing professionals generally starting time with a starter Kit and gradually shift to latest universal kits and stations.

BGA Reballing Kit

Contents of BGA Reballing Kit

ESD-Safe Cleaning Brush.
BGA Reballing Stencil.
BGA Desoldering Wire / Wick / Braid
Solder Paste.
Acetone or IPA Solution.
Soldering Flux.
Estrus Resistant Kapton Record or Clips to concord the BGA IC to the Stencil.
PCB Holder.
Tweezers.
SMD Rework Station and Soldering Iron are generally NOT a part of the Kit.

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BGA Rework Station

How to Utilise a BGA Reballing Kit

Desolder and remove the BGA IC from the PCB.
Now clean the solder from the bottom of the IC and the PCB where the IC was soldered. Employ a soldering fe and desoldering wire or wick.
At present select the right size of the IC depending on the number of balls from the stencil supplied with the kit.
Place the IC on the stencil and tightly hold information technology with the stencil using clip or tape.
Now apply solder paste from the other side of the stencil. Solder paste will stick to the IC through the tiny holes in the stencil.
Now apply hot air using SMD rework station. This volition solidify the solder paste and it will form solder balls that will stick to the IC.
Now clean the IC with Acetone or IPA solution and remove it from the stencil.
At present the BGA is ready to solder back to the PCB. This is done by placing the IC on the PCB and applying heat.